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慧能泰WLCSP-6B封装eMarker芯片实现量产

5 31, 2020

近日,慧能泰Hynetek的WLCSP-6B超小型封装eMarker 芯片HUSB332实现量产, 该封装的尺寸是0.875mmx1.425mm,管脚定义如下:

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HUSB332主要特点如下:

随着WLCSP-6B和DFN-8L的量产,客户可以在原有的设计上不用更改PCB设计,快速实现产品的导入和量产。HUSB332的不同封装和管脚兼容型号总结如下:

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All rights reserved © 2022. All Rights Reserved By Hynetek Semiconductor Co,. Ltd.
Guangdong ICP No. 19101561 Contact Us | Privacy Policy | Terms of Sale